US Patent 7237332 Method of manufacturing wiring board
Patent 7237332 was granted and assigned to Nitto Denko on July, 2007 by the United States Patent and Trademark Office.
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Patent Inventor Names
Kenichi Ikeda0
Nobuharu Tahara0
Toshiyuki Kawashima0
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Patent abstract
The present invention provides a method of manufacturing a wiring board, including the steps of preparing a composite sheet having an adherent sheet containing a thermosetting resin adhered to a porous film or impregnated with at least a part thereof, laminating at least the composite sheet on a wiring layer having a wiring pattern formed on an insulating layer, and heating and pressurizing the laminated product thus obtained or heating and pressurizing it after the pressurization to integrate the laminated product.
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US Patent 07237332 Method of manufacturing wiring board US Patent 7237332 Method of manufacturing wiring board
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Patent Number
072373320
Patent Number
72373320
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Official Website
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Infobox
Is a
Current Assignee
Patent Jurisdiction
Patent Number
072373320
Date of Patent
July 3, 2007
0Patent Application Number
108204170
Date Filed
April 7, 2004
0Official Website
Patent Primary Examiner
Edits on 15 Jun, 2022
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US Patent 07237332 Method of manufacturing wiring board
Infobox
Is a
Current assignee
Patent jurisdiction
Patent number
07237332
Date of patent
July 3, 2007
Patent application number
10820417
Date Filed
April 7, 2004
Patent primary examiner
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