Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Kenichi Ikeda0
Nobuharu Tahara0
Toshiyuki Kawashima0
Date of Patent
July 3, 2007
0Patent Application Number
108204170
Date Filed
April 7, 2004
0Patent Primary Examiner
Patent abstract
The present invention provides a method of manufacturing a wiring board, including the steps of preparing a composite sheet having an adherent sheet containing a thermosetting resin adhered to a porous film or impregnated with at least a part thereof, laminating at least the composite sheet on a wiring layer having a wiring pattern formed on an insulating layer, and heating and pressurizing the laminated product thus obtained or heating and pressurizing it after the pressurization to integrate the laminated product.
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