US Patent 7217997 Ground arch for wirebond ball grid arrays

A structure provides for the control of bond wire impedance. In an example embodiment, there is an integrated circuit device comprising a semiconductor device die having a plurality of grounding pads, signal pads, and power pads and a package for mounting the integrated circuit and includes a conductive path having at least one reference trace that surrounds the integrated circuit. A grounding arch is disposed over the semiconductor device die.