Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Chris Wyland0
Date of Patent
May 15, 2007
0Patent Application Number
105650440
Date Filed
July 30, 2004
0Patent Primary Examiner
Patent abstract
A structure provides for the control of bond wire impedance. In an example embodiment, there is an integrated circuit device comprising a semiconductor device die having a plurality of grounding pads, signal pads, and power pads and a package for mounting the integrated circuit and includes a conductive path having at least one reference trace that surrounds the integrated circuit. A grounding arch is disposed over the semiconductor device die.
Timeline
No Timeline data yet.
Further Resources
No Further Resources data yet.
