Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
January 30, 2007
Patent Application Number
10913759
Date Filed
August 6, 2004
Patent Primary Examiner
Patent abstract
A metal filled damascene structure with improved electromigration resistance and method for forming the same, the method including providing a semiconductor process wafer comprising damascene openings; and, depositing metal and at least one metal dopant according to an ECD process to from a metal filled damascene comprising a doped metal alloy portion.
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