US Patent 7101271 Polishing head and chemical mechanical polishing apparatus
Patent 7101271 was granted and assigned to Samsung on September, 2006 by the United States Patent and Trademark Office.
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Patent abstract
An apparatus for polishing chemically and mechanically a wafer includes a membrane supporter and a membrane. The membrane has a pressure portion that is divided into a plurality of regions, and a partition portion extending from the border between the plurality regions. The partition portion of the membrane is fixed to a slider that can move up and down in a guide groove formed in the membrane supporter.
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US Patent 07101271 Polishing head and chemical mechanical polishing apparatus US Patent 7101271 Polishing head and chemical mechanical polishing apparatus
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Patent Number
0710127100
Patent Number
710127100
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Official Website
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Infobox
Is a
Current Assignee
Patent Jurisdiction
Patent Number
071012710
Date of Patent
September 5, 2006
0Patent Application Number
107391930
Date Filed
December 19, 2003
0Official Website
Patent Primary Examiner
Edits on 22 Sep, 2022
Golden AI
Infobox
Is a
Current Assignee
Patent Jurisdiction
Patent Number
071012710
Date of Patent
September 5, 2006
0Patent Application Number
107391930
Date Filed
December 19, 2003
0Official Website
Patent Primary Examiner
Edits on 7 Jun, 2022
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Edits on 17 Nov, 2021
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US Patent 07101271 Polishing head and chemical mechanical polishing apparatus
Infobox
Is a
Current assignee
Patent jurisdiction
Patent number
07101271
Date of patent
September 5, 2006
Patent application number
10739193
Date Filed
December 19, 2003
Patent primary examiner
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