US Patent 7101271 Polishing head and chemical mechanical polishing apparatus

Patent 7101271 was granted and assigned to Samsung on September, 2006 by the United States Patent and Trademark Office.

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Is a

Patent

Patent attributes

Current Assignee

Samsung

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

7101271

Date of Patent

September 5, 2006

Patent Application Number

10739193

Date Filed

December 19, 2003

Patent Primary Examiner

‌

M. Rachuba

Patent abstract

An apparatus for polishing chemically and mechanically a wafer includes a membrane supporter and a membrane. The membrane has a pressure portion that is divided into a plurality of regions, and a partition portion extending from the border between the plurality regions. The partition portion of the membrane is fixed to a slider that can move up and down in a guide groove formed in the membrane supporter.