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US Patent 12132020 Low temperature bonded structures

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
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Date Filed
December 13, 2023
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Date of Patent
October 29, 2024
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Patent Application Number
18539143
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Patent Citations
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US Patent 10707087 Processing stacked substrates
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US Patent 11256004 Direct-bonded lamination for improved image clarity in optical devices
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US Patent 11264357 Mixed exposure for large die
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US Patent 11276676 Stacked devices and methods of fabrication
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US Patent 11329034 Direct-bonded LED structure contacts and substrate contacts
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US Patent 11348898 Systems and methods for releveled bump planes for chiplets
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US Patent 11355443 Dielets on flexible and stretchable packaging for microelectronics
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US Patent 11515279 Low temperature bonded structures
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US Patent 11769747 Semiconductor device and method of manufacturing the same
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US Patent 6837979 Method and apparatus for depositing and controlling the texture of a thin film
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•••
Patent Inventor Names
Jeremy Alfred Theil
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Laura Wills Mirkarimi
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Guilian Gao
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Rajesh Katkar
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Cyprian Emeka Uzoh
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
12132020
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Patent Primary Examiner
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Scott B. Geyer
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