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US Patent 12131955 Gate structures for semiconductor devices

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Is a
Patent
Patent
0

Patent attributes

Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
0
Patent Number
121319550
Patent Inventor Names
Chung-Liang Cheng0
Date of Patent
October 29, 2024
0
Patent Application Number
177124860
Date Filed
April 4, 2022
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Patent Citations
‌
US Patent 9443771 Methods to thin down RMG sidewall layers for scalability of gate-last planar CMOS and FinFET technology
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US Patent 9520482 Method of cutting metal gate
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US Patent 9548303 FinFET devices with unique fin shape and the fabrication thereof
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US Patent 9564489 Multiple gate field-effect transistors having oxygen-scavenged gate stack
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US Patent 9576814 Method of spacer patterning to form a target integrated circuit pattern
0
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US Patent 9601342 FinFETs with strained well regions
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US Patent 9608116 FINFETs with wrap-around silicide and method forming the same
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US Patent 9698241 Integrated circuits with replacement metal gates and methods for fabricating the same
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...
Patent Primary Examiner
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Tong-Ho Kim
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CPC Code
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H01L 21/823828
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H01L 21/823857
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B82Y 10/00
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H01L 29/66795
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H01L 21/823842
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H01L 21/02244
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H01L 21/02252
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H01L 21/02603
0
...
Patent abstract

A semiconductor device with different configurations of gate structures and a method of fabricating the semiconductor device are disclosed. The semiconductor device includes first and second gate structures disposed on first and second nanostructured channel regions, respectively. The first gate structure includes a nWFM layer disposed on the first nanostructured channel region, a barrier layer disposed on the nWFM layer, a first pWFM layer disposed on the barrier layer, and a first gate fill layer disposed on the first pWFM layer. Sidewalls of the first gate fill layer are in physical contact with the barrier layer. The second gate structure includes a gate dielectric layer disposed on the second nanostructured channel region, a second pWFM layer disposed on the gate dielectric layer, and a second gate fill layer disposed on the pWFM layer. Sidewalls of the second gate fill layer are in physical contact with the gate dielectric layer.

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