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US Patent 12124087 Wideband surface coupling

Patent 12124087 was granted and assigned to Teramount on October, 2024 by the United States Patent and Trademark Office.

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 US Patent 12124087 Wideband surface coupling

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Patent abstract

A wideband photonic bump (WBB), including: a positive taper of a polymer waveguide configured to further expand a light beam from an inverse taper to match a fiber optical mode of an optical fiber; a curved mirror formed on a surface of the WBB configured to reflect a light beam from the optical fiber; and a tilted flat mirror configured to direct the reflected light beam to an external optical fiber, wherein the WBB is coupled on the surface of a photonic integrated circuit (PIC).

Infobox
Is a
Patent
Patent
1
Patent Applicant
Teramount
Teramount
1
Current Assignee
Teramount
Teramount
1
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
1
Patent Number
121240871
Patent Inventor Names
Abraham Israel1
Hesham Taha1
Date of Patent
October 22, 2024
1
Patent Application Number
171208161
Date Filed
December 14, 2020
1
Patent Citations
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US Patent 11394468 System and method for transferring optical signals in photonic devices and method of making the system
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US Patent 7058275 Stress relief in fibre optic arrays
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US Patent 11863917 Assembly of network switch ASIC with optical transceivers
1
Patent Primary Examiner
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Jennifer Doan
1
CPC Code
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G02B 6/12
1
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G02B 2006/12104
1
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G02B 6/305
1

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