Is a
Patent attributes
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Date of Patent
April 17, 2018
Patent Application Number
15382373
Date Filed
December 16, 2016
Patent Citations Received
Patent Primary Examiner
Patent abstract
A guide pin wafer may include a base wafer that includes multiple dies. Each die may include a corresponding lens cutout. The guide pin wafer may also include multiple guide pins mounted on the base wafer. Each die of the base wafer may be mounted with two or more corresponding guide pins that may be configured to engage a parallel fiber connector to the corresponding die.
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