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US Patent 12112923 Reaction chamber lining

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
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Date Filed
September 18, 2019
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Date of Patent
October 8, 2024
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Patent Application Number
17292796
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Patent Citations
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US Patent 8118938 Lower liner with integrated flow equalizer and improved conductance
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US Patent 8152925 Baffle plate and substrate processing apparatus
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US Patent 8360003 Plasma reactor with uniform process rate distribution by improved RF ground return path
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US Patent 9129778 Fluid distribution members and/or assemblies
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US Patent 10145012 Substrate processing apparatus and substrate processing method
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US Patent 9184028 Dual plasma volume processing apparatus for neutral/ion flux control
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US Patent 10504719 Cooled reflective adapter plate for a deposition chamber
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US Patent 7166166 Method and apparatus for an improved baffle plate in a plasma processing system
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US Patent 7552521 Method and apparatus for improved baffle plate
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Patent Inventor Names
Yonggang Hou
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Zhaochao Chen
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Dongdong Hu
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Chengyi Wang
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Na Li
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Shiran Cheng
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Haiyang Liu
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Kaidong Xu
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
12112923
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Patent Primary Examiner
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Michael C Romanowski
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CPC Code
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H05H 7/14
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H01J 37/32458
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H01J 37/32495
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