Patent attributes
A cooling device for cooling a chip and a cooling system using the cooling device are disclosed. The cooling device includes a cooling layer, an internal channel, and a vapor layer. The cooling layer is divided into multiple cooling regions for cooling different regions of the chip. The internal connection is divided into multiple sections corresponding to the multiple cooling regions. Two-phase coolant entering the cooling layer is converted to mixed fluid, which is elevated to each internal section, where at least a portion of the vapor in the mixed fluid is extracted and the remaining mixed fluid is either distributed to the next cooling region or exit the cooling device. The cooling system includes at least one such cooling device, a fluid loop for recirculating liquid in the mixed fluid in the loop, and a vapor loop for recirculating vapor in the mixed fluid exiting the cooling device.
