US Patent 7597134 Heat dissipation device with a heat pipe

A heat dissipation device comprises at least two heat pipes (10) and a plurality of fins (20) thermally connected with the heat pipes (10). Each of the heat pipes (10) comprises a flattened evaporating portion (12) and a condensing portion (14). The evaporating portions (12) are closely connected with each other. A flat bottom surface (125) of the evaporating portions (12) of the heat pipes (10) directly engages with an electronic component. A flat top surface (120) of the evaporating portions (12) of the heat pipes (10) directly engages with a bottom surface of the fins (20). The condensing portions (14) of the heat pipes (10) extend through the fins (20).