US Patent 12068298 High power density 3D semiconductor module packaging
Is a
Date Filed
November 2, 2020
0
Date of Patent
August 20, 2024
0
Patent Application Number
17430754
0
Patent Inventor Names
Haihui Luo
0
Guoyou Liu
0
Yangang Wang
0
Patent Jurisdiction
Patent Number
Patent Primary Examiner
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