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US Patent 12061502 Expandable thermal solution for laptops

Patent 12061502 was granted and assigned to Intel on August, 2024 by the United States Patent and Trademark Office.

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Contents

Is a
Patent
Patent
0

Patent attributes

Patent Applicant
Intel
Intel
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Current Assignee
Intel
Intel
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
120615020
Patent Inventor Names
Howe Yin Loo0
Yew San Lim0
Cora Shih Wei Nien0
Jeff Ku0
Chin Kung Goh0
Tin Poay Chuah0
Date of Patent
August 13, 2024
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Patent Application Number
173688510
Date Filed
July 7, 2021
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Patent Citations
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US Patent 11592882 Variable fin stack
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US Patent 11874713 Electronic device
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US Patent 11630494 Housing structure and terminal device
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US Patent 7327568 Heat sink assembly with rotatable fins
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US Patent 7532475 Semiconductor chip assembly with flexible metal cantilevers
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US Patent 11262821 Information handling system with articulated cooling fins between interleaved and separated positions
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US Patent 11262822 Information handling system dynamic cooling fan articulation to manage thermal parameters
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US Patent 11320876 Information handling system handle with integrated thermal rejection system
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Patent Primary Examiner
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Robert J Hoffberg
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CPC Code
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G06F 1/1616
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G06F 1/203
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Patent abstract

According to the present disclosure, a laptop may be provided with a compartment including a moveable segment, an expandable heat exchanger with a movable section, and an expandable fan unit. The release of the movable segment of the compartment from a lower portion of the compartment produces an opening in the compartment and the movable section of the expandable heat exchanger is extended downward, and the expandable fan unit is lowered when the movable segment of the compartment is released.

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