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US Patent 11874713 Electronic device

Patent 11874713 was granted and assigned to Compal Electronics on January, 2024 by the United States Patent and Trademark Office.

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Contents

Is a
Patent
Patent
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Patent attributes

Current Assignee
Compal Electronics
Compal Electronics
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
118747130
Patent Inventor Names
Tsai-Sheng Yang0
Wei-Ting Chen0
I-Lung Chen0
Chien Chiu0
Tzu-Chien Lai0
I-Hsuan Tsai0
Date of Patent
January 16, 2024
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Patent Application Number
178806020
Date Filed
August 3, 2022
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Patent Citations
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US Patent 8976524 Electronic device
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US Patent 8937806 Flow diversion apparatuses and methods
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US Patent 9104374 Electronic device
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US Patent 9372511 Electronic device
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US Patent 9582048 Hinge assembly
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US Patent 9740253 Electronic apparatus
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US Patent 9983636 Hinge assembly
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US Patent 10241540 Portable electronic device capable of enhancing heat dissipation
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...
Patent Citations Received
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US Patent 12061502 Expandable thermal solution for laptops
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Patent Primary Examiner
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Adrian S Wilson
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CPC Code
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G06F 1/1667
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G06F 1/1681
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G06F 1/203
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G06F 1/206
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G06F 1/1666
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H05K 7/20172
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H05K 7/20209
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G06F 1/1616
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Patent abstract

An electronic device includes a first body including a first part and a second part hinged to each other, a second body, and a hinge structure hinged between an edge of the second body and the second part. The first part has a recess. When the second body is unfolded relative to the first body from a folded state to a first unfolded state, the hinge structure pushes against the first part to rotate the first part relative to the second part. When the second body is continuously unfolded relative to the first body from the first unfolded state to a second unfolded state, the edge of the second body pushes against the first part, so that the first part continues to rotate relative to the second part. When the second body is in the folded state, the hinge structure is at least partially accommodated in the recess.

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