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US Patent 12016131 Transfer printing high-precision devices

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
0
Date Filed
December 30, 2021
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Date of Patent
June 18, 2024
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Patent Application Number
17566593
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Patent Citations
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US Patent 9704821 Stamp with structured posts
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US Patent 9865600 Printed capacitors
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US Patent 9923133 Structures and methods for testing printable integrated circuits
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US Patent 10396137 Testing transfer-print micro-devices on wafer
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US Patent 10748793 Printing component arrays with different orientations
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US Patent 11710680 RF devices with enhanced performance and methods of forming the same
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US Patent 8525167 Laminated chips package, semiconductor substrate and method of manufacturing the laminated chips package
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US Patent 8722458 Optical systems fabricated by printing-based assembly
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US Patent 9358775 Apparatus and methods for micro-transfer-printing
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US Patent 9362113 Engineered substrates for semiconductor epitaxy and methods of fabricating the same
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Patent Inventor Names
Ronald S. Cok
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Christopher Andrew Bower
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Matthew Alexander Meitl
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
12016131
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Patent Primary Examiner
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Xiaoliang Chen
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CPC Code
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H01L 24/03
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H01L 24/06
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H01L 24/49
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H01L 24/92
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H01L 24/97
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H01L 24/98
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H01L 25/075
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H01L 25/0753
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H01L 25/0657
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H01L 33/0095
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