US Patent 12006442 Additive manufacturing of polishing pads
Patent 12006442 was granted and assigned to Applied Materials on June, 2024 by the United States Patent and Trademark Office.
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US Patent 12006442 Additive manufacturing of polishing pads
Article
Patent abstract
A system, formulation, and method for additive manufacturing of a polishing layer of a polishing pad. The formulation includes a urethane acrylate oligomer based on a difunctional polyol or difunctional polythiol. The techniques includes selecting the difunctional polyol or the difunctional polythiol to affect a property of the polishing layer. The formulation also includes a monomer and a photoinitiator. The viscosity of the formulation is applicable for 3D printing of the polishing layer.
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Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Atul Bhaskar Chaudhari0
Sivapackia Ganapathiappan0
Srobona Sen0
Date of Patent
June 11, 2024
0Patent Application Number
166817000
Date Filed
November 12, 2019
0Patent Citations
Patent Primary Examiner
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