Patent attributes
A method of manufacturing a printed circuit board (PCB) includes forming a tridimensional (3D) dielectric substrate on a fiber-reinforced polymer with opposite sides; forming each side with channels and pockets by molding dielectric laminate, and the channels and pockets define a layout for conductive traces and pads of the PCB; forming the channels and pockets in a same side of the 3D dielectric substrate at a uniform depth; forming side walls of the channels and pockets of the 3D dielectric substrate with a draft angle in a range of greater than 0 degrees to about 5 degrees; depositing by electrolytic metallization the conductive traces and pads into the channels and pockets of the 3D dielectric substrate; and the outer surface of those conductive traces and pads are flush with the sides of the 3D dielectric substrate.
