US Patent 11973174 LED displays fabricated using hybrid bonding
Patent 11973174 was granted and assigned to Tectus Corporation on April, 2024 by the United States Patent and Trademark Office.
All edits
Edits on 1 May, 2024
Golden AI
Edits made to:
Infobox (+20 properties)
Article (+156 characters)
US Patent 11973174 LED displays fabricated using hybrid bonding
Article
Patent abstract
High-density GaN-based LED displays fabricated using wafer-to-wafer hybrid bonding and incorporating s color conversion region are disclosed.
Infobox
Is a
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Henry Choy0
Paul Martin0
Date of Patent
April 30, 2024
0Patent Application Number
182067600
Date Filed
June 7, 2023
0Patent Citations
Patent Primary Examiner
CPC Code
Find more entities like US Patent 11973174 LED displays fabricated using hybrid bonding
Use the Golden Query Tool to find similar entities by any field in the Knowledge Graph, including industry, location, and more.
By using this site, you agree to our Terms of Service.