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US Patent 11973174 LED displays fabricated using hybrid bonding

Patent 11973174 was granted and assigned to Tectus Corporation on April, 2024 by the United States Patent and Trademark Office.

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Contents

Is a
Patent
Patent
0

Patent attributes

Patent Applicant
Tectus Corporation
Tectus Corporation
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Current Assignee
Tectus Corporation
Tectus Corporation
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
119731740
Patent Inventor Names
Paul Martin0
Henry Choy0
Date of Patent
April 30, 2024
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Patent Application Number
182067600
Date Filed
June 7, 2023
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Patent Citations
‌
US Patent 10388641 Ultra-dense LED projector
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US Patent 9196653 Pixelated LED
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US Patent 7592637 Light emitting diodes with reflective electrode and side electrode
0
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US Patent 8058663 Micro-emitter array based full-color micro-display
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US Patent 8552436 Light emitting diode structure
0
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US Patent 9041025 Monolithic full-color LED micro-display on an Active Matrix panel manufactured using flip-chip technology
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US Patent 9047818 CMOS IC for micro-emitter based microdisplay
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Patent Primary Examiner
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Andrew J Coughlin
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CPC Code
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H01L 25/0753
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H01L 33/62
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Patent abstract

High-density GaN-based LED displays fabricated using wafer-to-wafer hybrid bonding and incorporating s color conversion region are disclosed.

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