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US Patent 11971445 Integrated circuit and associated method

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
0
Date Filed
February 23, 2022
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Date of Patent
April 30, 2024
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Patent Application Number
17652115
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Patent Citations
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US Patent 10670649 Bondwire testing of IC using pin diode signatures
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US Patent 10845428 Method and circuit for detecting a loss of a bondwire in a power switch
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US Patent 6911739 Methods and apparatus for improving high frequency input/output performance
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US Patent 7132359 Tolerance bondwire inductors for analog circuitry
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US Patent 7332814 Bondwire utilized for coulomb counting and safety circuits
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US Patent 7382597 Method and apparatus for a bondwire decoupling filter for an integrated voltage regulator and transceiver
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US Patent 7550806 Bondwire utilized for coulomb counting and safety circuits
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US Patent 8021973 System and method to reduce the bondwire/trace inductance
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US Patent 8030763 Semiconductor package with reduced inductive coupling between adjacent bondwire arrays
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US Patent 8250506 Bondwire design
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•••
Patent Inventor Names
Anton Salfelner
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
11971445
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Patent Primary Examiner
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Dominic E Hawkins
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CPC Code
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G01R 31/2884
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G01R 31/2853
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G01R 31/2856
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H01L 2224/49113
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H01L 24/48
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H01L 2224/48245
0
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G01R 31/2896
0

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