US Patent 7550806 Bondwire utilized for coulomb counting and safety circuits

A sense resistor and integrated circuit package combination is disclosed. A package lead frame is provided having a plurality of landing zones associated therewith and a die mounting area for mounting of a die thereon. The die has a plurality of bond pads associated therewith, with a first bond wire connected between a first one of the landing zones and a second one of the landing zones. The first bond wire forms a sense resistor with a resistance of a known value. A second bond wire is connected between the first one of the landing zones and a first one of the bond pads.