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US Patent 11967899 Fluid cooled inverter

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
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Date Filed
March 4, 2021
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Date of Patent
April 23, 2024
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Patent Application Number
17191805
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Patent Citations
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US Patent 8472188 Semiconductor power module, inverter, and method of manufacturing a power module
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US Patent 7095098 Electrically isolated and thermally conductive double-sided pre-packaged component
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US Patent 7262444 Power semiconductor packaging method and structure
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US Patent 7547966 Power semiconductor module
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US Patent 7659614 High temperature, stable SiC device interconnects and packages having low thermal resistance
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US Patent 7786486 Double-sided package for power module
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US Patent 7834448 Fluid cooled semiconductor power module having double-sided cooling
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US Patent 7916480 Busbar assembly with integrated cooling
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US Patent 7952875 Stacked busbar assembly with integrated cooling
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US Patent 7999369 Power electronic package having two substrates with multiple semiconductor chips and electronic components
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•••
Patent Inventor Names
Jean-Claude Harel
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
11967899
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Patent Primary Examiner
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Kevin J Comber
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CPC Code
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H02M 3/137
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H02M 3/28
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H02M 3/315
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H02M 3/3155
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H02M 3/325
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H02M 3/335
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H02M 7/10
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H02M 7/515
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H02M 7/521
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H02M 7/53
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•••

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