Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Erich William Gerbsch0
Ralph S. Taylor0
Date of Patent
August 22, 2006
0Patent Application Number
109461840
Date Filed
September 21, 2004
0Patent Citations Received
Patent Primary Examiner
Patent abstract
An electrically isolated and thermally conductive double-sided pre-packaged IC component, stamped lead members, drain pads, source pads, gate runner, and a MOSFET, IGBT, etc. are positioned between a pair of ceramic substrate members. Layers of solderable copper material are directly bonded to the inner and outer surfaces of the substrate members.
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