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US Patent 11937372 Biphasic material and stretchable circuit board

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 US Patent 11937372 Biphasic material and stretchable circuit board

Article

Patent abstract

A biphasic composition comprises a quantity of liquid GaIn and a plurality of solid particles of Ga

Infobox
Is a
Patent
Patent
0
Patent Applicant
Yale University
Yale University
0
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
119373720
Patent Inventor Names
Dylan Shah0
Lina Mercedes Sanchez Botero0
Rebecca Kramer-Bottiglio0
Shanliangzi Liu0
Date of Patent
March 19, 2024
0
Patent Application Number
173570600
Date Filed
June 24, 2021
0
Patent Citations
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US Patent 11088063 Structures with deformable conductors
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US Patent 11156509 Sensors with deformable conductors and selective deformation
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US Patent 11184975 Method of creating a flexible circuit
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US Patent 9228822 Non-differential elastomer curvature sensor
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US Patent 11222735 Deformable conductors and related sensors, antennas and multiplexed systems
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US Patent 11232883 Polymer composite with liquid phase metal inclusions
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US Patent 10462897 Integrated electronic device with flexible and stretchable substrate
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US Patent 10645803 Soft, multilayered electronics for wearable devices and methods to produce the same
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US Patent 10672530 Deformable conductors and related sensors, antennas and multiplexed systems
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US Patent 10720261 Polymer composite with liquid phase metal inclusions
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US Patent 10757815 Method for fabrication of a soft-matter printed circuit board
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US Patent 10777483 Method, apparatus, and assembly for thermally connecting layers
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US Patent 10945339 High-density soft-matter electronics
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US Patent 11017915 Stretchable electronics and methods of making the same
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US Patent 11335622 Method, apparatus, and assembly for thermally connecting layers
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US Patent 11395413 Liquid metal fusion with conductive inks and pastes
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US Patent 11523514 Method for fabrication of a soft-matter printed circuit board
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US Patent 11585705 Sensors with deformable conductors and selective deformation
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US Patent 11594480 Structures with deformable conductors
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US Patent 11619554 Deformable sensors with selective restraint
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US Patent 11607863 Functional materials between deformable bonded layers
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US Patent 11664565 Deformable conductive structures and methods for fabrication
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US Patent 11682276 Multi-site damage sensing and localization soft-matter electronics and related systems and methods
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US Patent 11682615 Continuous interconnects between heterogeneous materials
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US Patent 11688677 Continuous interconnects between heterogeneous materials
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Patent Primary Examiner
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Haidung D Nguyen
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CPC Code
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H01B 1/02
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H05K 3/4635
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H05K 2201/0233
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H05K 1/0393
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H05K 1/0283
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