US Patent 11664565 Deformable conductive structures and methods for fabrication

A conductive assembly may include a deformable substrate disposed around an axis, and a deformable conductor arranged on the deformable substrate. The substrate may be arranged to form a channel along the axis, and the deformable conductor may be arranged on the deformable substrate to form a waveguide. The deformable substrate, the first deformable conductor, and a second deformable conductor may be arranged to form a microstrip or a coaxial transmission line. A deformable transmission line may include a deformable substrate arranged in a substantially enclosed channel around an axis, a first deformable conductor arranged in a trace along the axis of the deformable substrate, and a second deformable conductor arranged on the deformable substrate to form a reference conductor for the first deformable conductor. A method of fabricating a deformable conductive assembly may include forming a deformable conductor on a deformable substrate, and disposing the deformable substrate around an axis.