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US Patent 11871549 Heat conduction mechanism

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
0
Date Filed
May 8, 2020
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Date of Patent
January 9, 2024
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Patent Application Number
17608941
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Patent Citations
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US Patent 10932393 Torsional heat pipe
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US Patent 11272639 Heat dissipation panel, heat dissipation apparatus, and electronic device
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US Patent 7969739 Heat diffusing structure of a portable electronic apparatus
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US Patent 8964377 Electronic device having slide-tilt operation
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US Patent 10551886 Display with integrated graphite heat spreader and printed circuit board insulator
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Patent Inventor Names
Hiroto Yamada
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
11871549
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Patent Primary Examiner
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Michael A Matey
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CPC Code
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H05K 7/20963
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H05K 7/2049
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G06F 1/163
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G06F 1/206
0

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