Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Hiroto Yamada1
Date of Patent
January 9, 2024
1Patent Application Number
176089411
Date Filed
May 8, 2020
1Patent Citations
Patent Primary Examiner
CPC Code
Patent abstract
Provided is a heat conduction mechanism including: a first member including at least one heat source; a second member including a heat dissipation element, the second member displaceable with respect to the first member; and a heat conductive sheet that transfers heat of the heat source to the heat dissipation element, in which a protective sheet is provided to a portion of the heat conductive sheet that can be in contact with at least a part of the first member or the second member.
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