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US Patent 11854894 Integrated circuit device structures and double-sided electrical testing

Patent 11854894 was granted and assigned to Intel on December, 2023 by the United States Patent and Trademark Office.

OverviewStructured DataIssuesContributors
Is a
Patent
Patent
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Current Assignee
Intel
Intel
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Date Filed
December 4, 2020
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Date of Patent
December 26, 2023
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Patent Applicant
Intel
Intel
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Patent Application Number
17112697
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Patent Citations
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US Patent 8018008 Semiconductor device including a plurality of chips and method of manufacturing semiconductor device
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US Patent 7091534 Semiconductor device using low dielectric constant material film and method of fabricating the same
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US Patent 7402866 Backside contacts for MOS devices
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US Patent 7825472 Semiconductor device having a plurality of stacked transistors and method of fabricating the same
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US Patent 8395191 Semiconductor device and structure
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US Patent 8426888 Vertical semiconductor device with thinned substrate
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US Patent 9129926 Display device including thin film transistor
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US Patent 9171887 Semiconductor device and method of manufacturing same
0
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US Patent 9184136 Semiconductor devices and methods for fabricating the same
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US Patent 9305834 Methods for fabricating integrated circuits using designs of integrated circuits adapted to directed self-assembly fabrication to form via and contact structures
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•••
Patent Inventor Names
Rishabh Mehandru
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Paul Fischer
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Bruce Block
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Doug Ingerly
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Kimin Jun
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Kevin O'Brien
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Patrick Morrow
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Valluri R. Rao
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Szuya S. Liao
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
11854894
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Patent Primary Examiner
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Jesse Y Miyoshi
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CPC Code
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H01L 22/14
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H01L 29/7827
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H01L 29/7828
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