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US Patent 11854855 Micro-transfer printing with selective component removal
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Patent
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Date Filed
July 1, 2020
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Date of Patent
December 26, 2023
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Patent Application Number
16919072
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Patent Citations
US Patent 8877648 Methods of forming printable integrated circuit devices by selective etching to suspend the devices from a handling substrate and devices formed thereby
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US Patent 8722458 Optical systems fabricated by printing-based assembly
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US Patent 8791474 Light emitting diode display with redundancy scheme
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US Patent 8794501 Method of transferring a light emitting diode
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US Patent 8835940 Micro device stabilization post
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US Patent 8865489 Printed assemblies of ultrathin, microscale inorganic light emitting diodes for deformable and semitransparent displays
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US Patent 8889485 Methods for surface attachment of flipped active componenets
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US Patent 8934259 Substrates with transferable chiplets
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US Patent 8941215 Micro device stabilization post
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US Patent 8987765 Reflective bank structure and method for integrating a light emitting device
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•••
Patent Inventor Names
James O. Thostenson
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Christopher Andrew Bower
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Erich Radauscher
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Matthew Alexander Meitl
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Ronald S. Cok
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Patent Jurisdiction
United States Patent and Trademark Office
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Patent Number
11854855
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Patent Primary Examiner
Sheikh Maruf
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CPC Code
H01L 2221/68359
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G03F 7/0002
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H05K 1/111
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B29C 59/026
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H01L 21/6835
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H01L 21/7806
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H01L 21/568
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H01L 21/306
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H01L 23/3171
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H01L 24/24
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•••
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