US Patent 11837680 Substrate structuring methods
Patent 11837680 was granted and assigned to Applied Materials on December, 2023 by the United States Patent and Trademark Office.
Is a
Current Assignee
Date Filed
May 18, 2022
0
Date of Patent
December 5, 2023
0
Patent Applicant
Patent Application Number
17747408
0
Patent Citations
•••
Patent Inventor Names
Han-Wen Chen
0
Giback Park
0
Steven Verhaverbeke
0
Patent Jurisdiction
Patent Number
Patent Primary Examiner
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