US Patent 11789610 3D-stacked memory with reconfigurable compute logic
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US Patent 11789610 3D-stacked memory with reconfigurable compute logic
Article
Patent abstract
A 3D-stacked memory device including: a base die including a plurality of switches to direct data flow and a plurality of arithmetic logic units (ALUs) to compute data; a plurality of memory dies stacked on the base die; and an interface to transfer signals to control the base die.
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Patent Number
Patent Inventor Names
Dimin Niu
Hongzhong Zheng
Mu-Tien Chang
Prasun Gera
Date of Patent
October 17, 2023
Patent Application Number
17353393
Date Filed
June 21, 2021
Patent Citations
Patent Primary Examiner
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