Create
Log in
Sign up
Golden has been acquired by ComplyAdvantage.
Read about it here ⟶
US Patent 11789610 3D-stacked memory with reconfigurable compute logic
Overview
Structured Data
Issues
Contributors
Activity
Access by API
Access by API
Is a
Patent
Date Filed
June 21, 2021
Date of Patent
October 17, 2023
Patent Application Number
17353393
Patent Citations
US Patent 8737108 3D memory configurable for performance and power
US Patent 9286948 Query operations for stacked-die memory device
US Patent 8922243 Die-stacked memory device with reconfigurable logic
US Patent 9959929 Memory device and method having on-board processing logic for facilitating interface with multiple processors, and computer system using same
US Patent 8064739 Three-dimensional die stacks with inter-device and intra-device optical interconnect
US Patent 8369123 Stacked memory module and system
Patent Inventor Names
Hongzhong Zheng
Dimin Niu
Mu-Tien Chang
Prasun Gera
Patent Jurisdiction
United States Patent and Trademark Office
Patent Number
11789610
Patent Primary Examiner
David Yi
CPC Code
G06F 3/0673
G06F 9/30196
G06F 15/785
G06F 13/14
G06F 13/40
G11C 7/1006
G11C 5/04
Y02D 10/00
G06F 3/0659
G06F 3/0635
•••
Find more entities like US Patent 11789610 3D-stacked memory with reconfigurable compute logic
Use the Golden Query Tool to find similar entities by any field in the Knowledge Graph, including industry, location, and more.
Open Query Tool
Access by API
Company
Home
Press & Media
Blog
Careers
WE'RE HIRING
Products
Knowledge Graph
Query Tool
Data Requests
Knowledge Storage
API
Pricing
Enterprise
ChatGPT Plugin
Legal
Terms of Service
Enterprise Terms of Service
Privacy Policy
Help
Help center
API Documentation
Contact Us
By using this site, you agree to our
Terms of Service
.
SUBSCRIBE