US Patent 11789221 Techniques for device cooling in an optical sub-assembly
Patent 11789221 was granted and assigned to Aeva, Inc. on October, 2023 by the United States Patent and Trademark Office.
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US Patent 11789221 Techniques for device cooling in an optical sub-assembly
Article
Patent abstract
An optical sub-assembly includes a diode submount structure, a diode mounted to the diode submount, and a thermoelectric cooler (TEC). The TEC is in thermal contact with the diode, and the diode is positioned between the diode submount structure and the TEC.
Infobox
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Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Kevin Kinichi Masuda
Pradeep Srinivasan
Wenjing Liang
Zhizhong Tang
Date of Patent
October 17, 2023
Patent Application Number
17494415
Date Filed
October 5, 2021
Patent Citations
Patent Primary Examiner
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