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US Patent 11789221 Techniques for device cooling in an optical sub-assembly

Patent 11789221 was granted and assigned to Aeva, Inc. on October, 2023 by the United States Patent and Trademark Office.

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Patent attributes

Patent Applicant

Current Assignee

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

Patent Inventor Names

Pradeep Srinivasan

Zhizhong Tang

Kevin Kinichi Masuda

Wenjing Liang

Date of Patent

October 17, 2023

Patent Application Number

17494415

Date Filed

October 5, 2021

Patent Citations

US Patent 10615567 Packaging of a directly modulated laser chip in photonics module

US Patent 7298941 Optical coupling to IC chip

US Patent 7899105 Temperature control system for a frequency converted diode laser

US Patent 9762026 Optical module

US Patent 10181694 Optical module

US Patent 11075500 Optical device having a substrate and a laser unit that emits light into the substrate

Patent Primary Examiner

M. A. Golub-Miller

CPC Code

Patent abstract

An optical sub-assembly includes a diode submount structure, a diode mounted to the diode submount, and a thermoelectric cooler (TEC). The TEC is in thermal contact with the diode, and the diode is positioned between the diode submount structure and the TEC.

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