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US Patent 11765916 Memory device and method of manufacturing memory device

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Contents

Is a
Patent
Patent

Patent attributes

Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
11765916
Patent Inventor Names
Daisaburo Takashima
Yoshiki Kamata
Yoshiaki Asao
Rieko Funatsuki
Takahiko Iizuka
Ryu Ogiwara
Misako Morota
Yukihiro Nomura
Date of Patent
September 19, 2023
Patent Application Number
17348839
Date Filed
June 16, 2021
Patent Citations
‌
US Patent 11017854 Storage device having a memory cell with a variable resistance element, in which voltage applied to a word line of the memory cell is controlled based on voltage of a bit line of the memory cell
‌
US Patent 11373703 Semiconductor storage device
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US Patent 9025369 Resistance change nonvolatile semiconductor memory device
‌
US Patent 9679650 3D NAND memory Z-decoder
‌
US Patent 9966136 Semiconductor memory device including variable resistance element
‌
US Patent 10651239 Storage device
‌
US Patent 10686012 Resistance change type memory
‌
US Patent 10832742 Semiconductor storage device
...
Patent Citations Received
‌
US Patent 12069872 Memory device and method of manufacturing memory device
0
Patent Primary Examiner
‌
Leon Viet Q Nguyen
CPC Code
‌
G11C 13/003
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G11C 13/0004
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H01L 45/1683
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G11C 2213/75
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H01L 45/06
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H01L 27/2454
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H01L 27/249
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H01L 45/144
...
Patent abstract

A memory device includes: a first interconnect; a second interconnect; a first string and a second string whose first ends are coupled to the first interconnect; a third string and a fourth string whose second ends are coupled to the second interconnect; a third interconnect; and driver. The third interconnect is coupled to second ends of the first and second strings and to first ends of the third and fourth strings. Each of the first, second, third, and fourth strings includes a first switch element and a memory cell coupled in series. The memory cell includes a second switch element and a resistance change element coupled in parallel. The third interconnect is coupled to the driver via the first interconnect or the second interconnect.

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