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US Patent 11764122 3D flex-foil package
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Is a
Patent
Date Filed
February 27, 2020
Date of Patent
September 19, 2023
Patent Application Number
16803378
Patent Citations
US Patent 9018742 Electronic device and a method for fabricating an electronic device
US Patent 9692009 Device and method for producing hermetically-sealed cavities
US Patent 8563358 Method of producing a chip package, and chip package
Patent Inventor Names
Robert Faul
Patent Jurisdiction
United States Patent and Trademark Office
Patent Number
11764122
Patent Primary Examiner
Alexander O Williams
CPC Code
H01L 23/315
H01L 2224/48248
H01L 2224/81903
H01L 2924/15151
H01L 2223/54486
H01L 2224/32057
H01L 2224/131
H01L 2224/1134
H01L 2224/32257
H01L 2224/9211
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