US Patent 11764122 3D flex-foil package
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US Patent 11764122 3D flex-foil package
Article
Patent abstract
A flexible foil-based package is disclosed which comprises at least one flexible foil substrate on which at least one electronic device is mounted in flip-chip mounting technology. The flexible foil substrate is bent so that a recess is created in which the electronic device is arranged. A casting compound is applied to cover the electronic device.
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Patent Jurisdiction
Patent Number
Patent Inventor Names
Robert Faul
Date of Patent
September 19, 2023
Patent Application Number
16803378
Date Filed
February 27, 2020
Patent Citations
Patent Primary Examiner
CPC Code
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