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US Patent 11753727 Protection of components from corrosion

Patent 11753727 was granted and assigned to Applied Materials on September, 2023 by the United States Patent and Trademark Office.

OverviewStructured DataIssuesContributors
Is a
Patent
Patent
Current Assignee
Applied Materials
Applied Materials
Date Filed
May 6, 2021
Date of Patent
September 12, 2023
Patent Applicant
Applied Materials
Applied Materials
Patent Application Number
17313863
Patent Citations
‌
US Patent 7262133 Enhancement of copper line reliability using thin ALD tan film to cap the copper line
‌
US Patent 7264846 Ruthenium layer formation for copper film deposition
‌
US Patent 7265048 Reduction of copper dewetting by transition metal deposition
‌
US Patent 7279432 System and method for forming an integrated barrier layer
‌
US Patent 7285312 Atomic layer deposition for turbine components
‌
US Patent 7317229 Gate electrode structures and methods of manufacture
‌
US Patent 7371467 Process chamber component having electroplated yttrium containing coating
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US Patent 7396565 Multiple precursor cyclical deposition system
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US Patent 7404985 Noble metal layer formation for copper film deposition
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US Patent 7405158 Methods for depositing tungsten layers employing atomic layer deposition techniques
•••
Patent Inventor Names
Sukti Chatterjee
David Thompson
David Britz
Pravin K. Narwankar
Yuriy Melnik
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
11753727
Patent Primary Examiner
‌
Bret P Chen
CPC Code
‌
C23C 16/40
‌
C23C 16/52

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