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US Patent 11752590 Polishing head and polishing apparatus

Patent 11752590 was granted and assigned to Ebara Corporation on September, 2023 by the United States Patent and Trademark Office.

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
Current Assignee
Ebara Corporation
Ebara Corporation
Date Filed
October 27, 2021
Date of Patent
September 12, 2023
Patent Applicant
Ebara Corporation
Ebara Corporation
Patent Application Number
17511944
Patent Citations
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US Patent 9662764 Substrate holder, polishing apparatus, and polishing method
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US Patent 7635292 Substrate holding device and polishing apparatus
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US Patent 8454413 Multi-chamber carrier head with a textured membrane
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US Patent 10442056 Substrate holding apparatus and polishing apparatus
Patent Inventor Names
Osamu Nabeya
Yuichi Kato
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
11752590
Patent Primary Examiner
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Don M Anderson

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