US Patent 11638979 Additive manufacturing of polishing pads
Patent 11638979 was granted and assigned to Applied Materials on May, 2023 by the United States Patent and Trademark Office.
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Edits on 14 Aug, 2023
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Infobox (+8 properties)
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Patent Inventor Names
Ashwin Murugappan Chockalingam0
Daniel Redfield0
Mayu Felicia Yamamura0
Nag B. Patibandla0
Rajeev Bajaj0
Sivapackia Ganapathiappan0
Uma Sridhar0
Yingdong Luo0
Edits on 3 May, 2023
Golden AI
Edits made to:
Infobox (+11 properties)
Article (+266 characters)
US Patent 11638979 Additive manufacturing of polishing pads
Article
A polishing pad for a semiconductor fabrication operation includes a polishing region and a window region, wherein both regions are made of an interpenetrating polymer network formed from a free-radically polymerized material and a cationically polymerized material.
Infobox
Is a
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
116389790
Date of Patent
May 2, 2023
0Patent Application Number
168971950
Date Filed
June 9, 2020
0Patent Citations
Patent Primary Examiner
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