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US Patent 11638979 Additive manufacturing of polishing pads

Patent 11638979 was granted and assigned to Applied Materials on May, 2023 by the United States Patent and Trademark Office.

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Is a

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Patent attributes

Patent Applicant

Applied Materials

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Current Assignee

Applied Materials

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Patent Jurisdiction

United States Patent and Trademark Office

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Patent Number

Patent Inventor Names

Yingdong Luo0

Rajeev Bajaj0

Sivapackia Ganapathiappan0

Uma Sridhar0

Ashwin Murugappan Chockalingam0

Daniel Redfield0

Mayu Felicia Yamamura0

Nag B. Patibandla0

Date of Patent

May 2, 2023

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Patent Application Number

168971950

Date Filed

June 9, 2020

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Patent Citations

US Patent 10384330 Polishing pads produced by an additive manufacturing process

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US Patent 10399201 Advanced polishing pads having compositional gradients by use of an additive manufacturing process

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Patent Primary Examiner

Mohammad M Ameen

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A polishing pad for a semiconductor fabrication operation includes a polishing region and a window region, wherein both regions are made of an interpenetrating polymer network formed from a free-radically polymerized material and a cationically polymerized material.

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