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US Patent 11631586 Heterogeneous annealing method

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
0
Date Filed
June 26, 2020
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Date of Patent
April 18, 2023
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Patent Application Number
16914169
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Patent Citations
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US Patent 10454447 Surface acoustic wave device having a piezoelectric layer on a quartz substrate and methods of manufacturing thereof
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US Patent 10784191 Interface structures and methods for forming same
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US Patent 10790262 Low temperature bonded structures
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US Patent 10840135 Flat metal features for microelectronics applications
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US Patent 10840205 Chemical mechanical polishing for hybrid bonding
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US Patent 10854578 Diffused bitline replacement in stacked wafer memory
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US Patent 10879212 Processed stacked dies
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US Patent 10886177 3D chip with shared clock distribution network
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US Patent 10892246 Structures and methods for low temperature bonding using nanoparticles
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US Patent 10923408 Cavity packages
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•••
Patent Citations Received
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US Patent 12009338 Dimension compensation control for directly bonded structures
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Patent Inventor Names
Gaius Gillman Fountain
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Paul M. Enquist
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
11631586
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Patent Primary Examiner
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Shouxiang Hu
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CPC Code
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H01L 2224/83201
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H01L 2924/0002
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H01L 24/81
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H01L 24/16
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H01L 24/73
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H01L 24/26
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H01L 24/29
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H01L 27/0688
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H01L 24/09
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H01L 25/0657
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