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US Patent 11589479 Heat-rejecting media for use in dual-printed circuit board device

Patent 11589479 was granted and assigned to Dell on February, 2023 by the United States Patent and Trademark Office.

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Contents

Is a
Patent
Patent

Patent attributes

Patent Applicant
Dell
Dell
Current Assignee
Dell
Dell
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
11589479
Date of Patent
February 21, 2023
Patent Application Number
17487398
Date Filed
September 28, 2021
Patent Primary Examiner
‌
Michael A Matey
CPC Code
‌
H01L 51/529
‌
F28D 15/02
‌
F28D 15/0233
‌
F28F 13/00
‌
F28F 2013/006
‌
F28F 21/02
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F28F 21/00
‌
F28F 3/00
...

Heat-rejecting media configured to thermally couple to a heat-generating component of an information handling resource may include a source, a sink, and a thermally-conductive strip coupled between the source and the sink. The source may include a first flexible and thermally-conductive skin surrounding a first cavity comprising a first solid foam, such that mechanical compression by components of the information handling resource provides mechanical pressure for thermally coupling the source to the heat-generating component. The sink may include a second flexible and thermally-conductive skin surrounding a second cavity comprising a second solid foam, such that mechanical compression by components of the information handling resource provides mechanical pressure for thermally coupling the sink to a component of the information handling resource exposed externally to the information handling resource.

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