US Patent 11584848 Resin composition, heat-shrinkable film, and container
Patent 11584848 was granted and assigned to Denka (company) on February, 2023 by the United States Patent and Trademark Office.
Is a
Current Assignee
Date Filed
October 10, 2018
Date of Patent
February 21, 2023
Patent Applicant
Patent Application Number
16754946
Patent Citations Received
Patent Jurisdiction
Patent Number
Patent Primary Examiner
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