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US Patent 11584848 Resin composition, heat-shrinkable film, and container

Patent 11584848 was granted and assigned to Denka (company) on February, 2023 by the United States Patent and Trademark Office.

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Patent
Patent

Patent attributes

Patent Applicant
Denka (company)
Denka (company)
Current Assignee
Denka (company)
Denka (company)
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
11584848
Date of Patent
February 21, 2023
Patent Application Number
16754946
Date Filed
October 10, 2018
Patent Citations Received
‌
US Patent 11773251 Resin composition, heat-shrinkable film, and container
Patent Primary Examiner
‌
Tae H. Yoon

The resin composition includes a block copolymer including a vinyl aromatic hydrocarbon-derived structural unit and a conjugated diene-derived structural unit, the resin composition satisfying the following (1) to (3): (1) an area ratio of components having a molecular weight in terms of polystyrene of equal to or more than 400,000 with respect to all components is equal to or more than 8% and equal to or less than 50%; (2) at least one main peak of a loss tangent value (tan δ) measured under a condition of a frequency of 1 Hz at a temperature rising rate of 4° C./min in accordance with ISO 6721-1 is present in a range of equal to or more than 70° C. and equal to or less than 100° C.; and (3) a strain hardening degree (λ max) of a compression-molded specimen prepared in accordance with ISO 293 is equal to or more than 2.0.

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