US Patent 11574826 High-density substrate processing systems and methods
Patent 11574826 was granted and assigned to Applied Materials on February, 2023 by the United States Patent and Trademark Office.
Is a
Current Assignee
Date Filed
July 7, 2020
0
Date of Patent
February 7, 2023
0
Patent Applicant
Patent Application Number
16922874
0
Patent Citations
Patent Jurisdiction
Patent Number
Patent Primary Examiner
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