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US Patent 11538781 Integrated device packages including bonded structures

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Infobox (+1 properties)
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Patent Citations Received
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US Patent 12113056 Stacked dies and methods for forming bonded structures
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Infobox
Is a
Patent
Patent
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
115387810
Date of Patent
December 27, 2022
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Patent Application Number
176462380
Date Filed
December 28, 2021
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Patent Citations
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US Patent 11145626 Semiconductor package
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US Patent 10008844 Cable seal
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US Patent 10026605 Method of reducing residual contamination in singulated semiconductor die
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US Patent 10032722 Semiconductor package structure having am antenna pattern and manufacturing method thereof
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US Patent 10075657 Edgeless large area camera system
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US Patent 10204893 Stacked dies and methods for forming bonded structures
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US Patent 10269756 Die processing
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US Patent 10269853 Image sensor device
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US Patent 10276619 Semiconductor device structure with a conductive feature passing through a passivation layer
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US Patent 10276909 Structure comprising at least a first element bonded to a carrier having a closed metallic channel waveguide formed therein
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US Patent 10418277 Air gap spacer formation for nano-scale semiconductor devices
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US Patent 10446456 Integrated circuits protected by substrates with cavities, and methods of manufacture
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US Patent 10707087 Processing stacked substrates
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US Patent 10727204 Die stacking for multi-tier 3D integration
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US Patent 10727219 Techniques for processing devices
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US Patent 10790262 Low temperature bonded structures
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US Patent 10879212 Processed stacked dies
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US Patent 10964664 DBI to Si bonding for simplified handle wafer
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US Patent 10998292 Offset pads over TSV
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US Patent 11031285 Diffusion barrier collar for interconnects
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US Patent 11056348 Bonding surfaces for microelectronics
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US Patent 11056390 Structures and methods for reliable packages
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US Patent 11069734 Image sensor device
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US Patent 11256004 Direct-bonded lamination for improved image clarity in optical devices
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Patent Primary Examiner
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Didarul A Mazumder
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CPC Code
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H01L 2224/08145
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H01L 24/80
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H01L 24/08
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H01L 2224/80896
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H01L 2224/80895
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H01L 2224/80006
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H01L 21/78
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H01L 21/568
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H01L 21/565
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H01L 21/561
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Infobox
Patent Citations
‌
US Patent 10008844 Cable seal
0
Edits on 25 Mar, 2023
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